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Nichia STS-DA1-0013
SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE
MODEL : NESW020CT
LED
NICHIA CORPORATION
Nichia STS-DA1-0013
1.SPECIFICATIONS
(1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Reverse Voltage Power Dissipation Operating Temperature Storage Temperature Soldering Temperature
IFP Conditions :
Symbol IF IFP VR PD Topr Tstg Tsld
Absolute Maximum Rating 25 80 5 88 -30 ~ + 85 -40 ~ +100 Reflow Soldering : 260C Hand Soldering : 350C
and Duty < 1/10 =
(Ta=25C) Unit mA mA V mW C C for 10sec. for 3sec.
Pulse Width < 10msec. =
(2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Reverse Current IR Luminous Intensity Iv (Chromaticity Coordinate 1) x Chromaticity Coordinate 1 y Luminous Intensity Iv (Chromaticity Coordinate 2) Luminous Flux v (Chromaticity Coordinate 2) x Chromaticity Coordinate 2 y Please refer to CIE 1931 chromaticity diagram.
Condition IF=20[mA] VR= 5[V] IF=20[mA] IF=20[mA] IF=20[mA] IF=20[mA] IF=20[mA] IF=20[mA] IF=20[mA]
Typ. (3.2) (1.50) 0.310 0.320 (1.45) (3.5) 0.300 0.295
(Ta=25C) Max. Unit 3.5 V 50 A cd cd lm -
(3) Ranking Item Rank A17 Rank A16 Rank A15 Luminous Intensity Rank A14 Rank A13 Rank A12 Symbol Iv Iv Iv Iv Iv Iv Condition IF=20[mA] IF=20[mA] IF=20[mA] IF=20[mA] IF=20[mA] IF=20[mA] Min. 1.70 1.60 1.50 1.40 1.30 1.20
(Ta=25C) Max. Unit 1.80 cd 1.70 cd 1.60 cd 1.50 cd 1.40 cd 1.30 cd
Luminous Intensity Measurement allowance is 7%.
Color Ranks x y 0.2800 0.2480 Rank a52 0.2720 0.2820 0.2580 0.2720 0.2880 0.2620
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x y
0.2830 0.2440
(IF=20mA,Ta=25C) Rank a56 0.2800 0.2880 0.2910 0.2480 0.2620 0.2580
Nichia STS-DA1-0013 Rank a57 0.2720 0.2793 0.2820 0.2580 0.2755 0.2720 0.2910 0.2580 0.2960 0.2760 0.2910 0.2870 0.3062 0.2853 Rank a66 0.2880 0.2960 0.2620 0.2760 Rank bj2 0.2910 0.2990 0.2870 0.3010 Rank bj7 0.2887 0.2968 0.2916 0.3058 Rank bk6 0.3040 0.3120 0.2900 0.3040 0.2980 0.2710 0.3040 0.2900 0.2990 0.3010 0.3142 0.2993 Rank a62 0.2820 0.2910 0.2720 0.2870 Rank a67 0.2793 0.2887 0.2755 0.2916 Rank bj6 0.2960 0.3040 0.2760 0.2900 Rank bk2 0.2990 0.3070 0.3010 0.3150 Rank bk7 0.2968 0.3048 0.3058 0.3198
x y x y x y x y x y
x y x y x y x y x y
0.2880 0.2620 0.2820 0.2720 0.2980 0.2710 0.3040 0.2900 0.2990 0.3010
0.2960 0.2760 0.2910 0.2870 0.3062 0.2853 0.3120 0.3040 0.3070 0.3150
Color Coordinates Measurement allowance is 0.005. Basically, a shipment shall consist of the LEDs of a combination of the above ranks. The percentage of each rank in the shipment shall be determined by Nichia.
2.INITIAL
OPTICAL/ELECTRICAL
CHARACTERISTICS
Please refer to figure's page.
3.OUTLINE
DIMENSIONS
AND
MATERIALS
: : : Heat-Resistant Polymer Silicone Resin (with Diffused + Phosphor) Ag Plating Copper Alloy
Please refer to figure's page. Package Material as follows ; Encapsulating Resin Electrodes
4.PACKAGING
* The LEDs are packed in cardboard boxes after taping. Please refer to figure's page. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity * In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. * The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. * The boxes are not water resistant and therefore must be kept away from water and moisture. * When the LEDs are transported, we recommend that you use the same packing method as Nichia.
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Nichia STS-DA1-0013
5.LOT
NUMBER
The first six digits number shows lot number. The lot number is composed of the following characters; - Year ( 6 for 2006, 7 for 2007 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number - Ranking by Color Coordinates - Ranking by Luminous Intensity
B for Nov. )
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Nichia STS-DA1-0013
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Condition 1 Steady State Operating Life Condition 2 Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Vibration Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) Tsld=215 5C, 3sec. (Lead Solder) 0C ~ 100C 15sec. 15sec. -40C ~ 25C ~ 100C ~ 25C 30min. 5min. 30min. 5min. 25C ~ 65C ~ -10C 90%RH 24hrs./1cycle Ta=100C Ta=60C, Ta=-40C Ta=25C, IF=20mA Ta=25C, IF=25mA Ta=85C, IF=8.5mA 60C, RH=90%, IF=15mA Ta=-30C, IF=20mA JEITA ED-4701 400 403 JEITA ED-4702 JEITA ED-4702 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3directions, 4cycles 3mm, 5 1 sec. 5N, 10 1 sec. RH=90% Note 2 times Number of Damaged 0/50
1 time over 95% 20 cycles 100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 500 hrs. 1000 hrs. 500 hrs. 1000 hrs. 48min.
0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50
Substrate Bending Adhesion Strength
1 time 1 time
0/50 0/50
(2) CRITERIA FOR JUDGING DAMAGE Item Symbol Test Conditions Forward Voltage VF IF=20mA U.S.L.*) Reverse Current IR VR=5V U.S.L.*) Luminous Intensity IV IF=20mA L.S.L.**) 0.7 *) U.S.L. : Upper Standard Level **) L.S.L. : Lower Standard Level
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Criteria for Judgement Min. Max. 1.1 2.0
Nichia STS-DA1-0013
7.CAUTIONS
The LEDs are devices which are materialized by combining Blue LEDs and special phosphors. Consequently, the color of the LEDs is changed a little by an operating current. Care should be taken after due consideration when using LEDs. (1) Moisture Proof Package * When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. * The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the aluminum moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage * Storage Conditions Before opening the package : The LEDs should be kept at 30C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. * If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 24 hours at 65 5C * This product has silver plated metal parts that are inside and/or outside the package body. The silver plating becomes tarnished when being exposed to an environment which contains corrosive gases. Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics. Please do not expose the LEDs to corrosive atmosphere during storage. * After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the LEDs within an end product, and the gases entering into the product from the external atmosphere. The above should be taken into consideration when designing. * Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur.
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Nichia STS-DA1-0013 (3) Heat Generation * Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. * The operating current should be decided after considering the ambient maximum temperature of LEDs.
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Nichia STS-DA1-0013 (4) Soldering Conditions * The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. * Recommended soldering conditions
Reflow Soldering Lead Solder Pre-heat Pre-heat time Peak temperature Soldering time Condition 10 sec. Max. refer to Temperature - profile 1. 10 sec. Max. refer to Temperature - profile 2. (N2 reflow is recommended.) 120 ~ 150C 120 sec. Max. 240C Max. Lead-free Solder 180 ~ 200C 120 sec. Max. 260C Max. Temperature Soldering time 350C Max. 3 sec. Max. (one time only) Hand Soldering
Although the recommended soldering conditions are specified in the above table, reflow or hand soldering at the lowest possible temperature is desirable for the LEDs. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. [Temperature-profile (Surface of circuit board)] Use the conditions shown to the under figure.
<1 : Lead Solder>
2.5 ~ 5C / sec. Pre-heating 120 ~ 150C 60sec.Max.
Above 200C
<2 : Lead-free Solder>
1~ 5C / sec. 240C Max. 10sec. Max. 1~ 5C / sec. Pre-heating 180 ~ 200C 60sec.Max.
Above 220C
260C Max. 10sec. Max.
2.5 ~ 5C / sec.
120sec.Max.
120sec.Max.
[Recommended soldering pad design] Use the following conditions shown in the figure.
1.5 2.1 1.5 0.85
(Unit : mm)
* Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * Reflow soldering should not be done more than two times. * When soldering, do not put stress on the LEDs during heating. * After soldering, do not warp the circuit board.
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Nichia STS-DA1-0013 (5) Cleaning * It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. * Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. (6) Static Electricity * Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. * All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. * When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). * Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA) (7) Others * NESW020C complies with RoHS Directive. * Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum rating when using the LEDs with matrix drive. * The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. * Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. * The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). * User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. * The formal specifications must be exchanged and signed by both parties before large volume purchase begins. * The appearance and specifications of the product may be modified for improvement without notice.
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Nichia STS-DA1-0013
ICI Chromaticity Diagram
0.9 520 530 0.8 540 510 0.7 550
560 0.6 570 500 0.5 580 590
y
0.4 bj2 0.3 490 bk7 bj7 bk2 bk6 a67 bj6 a57 a66 a52 a56 a62
600 610 620 630
0.2
480 0.1 470 460
0
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
x
Color Coordinates Measurement allowance is 0.005.
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Forward Voltage vs. Forward Current
Forward Current IFP (mA) Relative Luminosity (a.u.) 100 80 Ta=25C
Forward Current vs. Relative Luminosity
3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 0 20 40 60 80 100 Forward Current IFP (mA) Ta=25C Allowable Forward Current IFP (mA)
Duty Ratio vs. Allowable Forward Current
200 Ta=25C 100 80 50 25 20 10
20 10 5
1 2.0
2.5 3.0 3.5 4.0 4.5 Forward Voltage VF (V)
1
5 10 20 50 100 Duty Ratio (%)
Ambient Temperature vs. Forward Voltage
3.8 3.6 3.4 3.2 3.0 2.8 2.6 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C) Relative Luminosity (a.u.) Forward Voltage VF (V) IFP=20mA IFP=5mA
Ambient Temperature vs. Relative Luminosity
2.0 IFP=20mA 1.0 Allowable Forward Current IF (mA)
Ambient Temperature vs. Allowable Forward Current
30 25 20 15 10 8.5 5 0 0 20 40 60 80 100 Ambient Temperature Ta (C)
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0.5
0.2 -40 -20 0 20 40 60 80 100 Ambient Temperature Ta (C)
Nichia STS-DA1-0013
Model
NESW020C
NICHIA CORPORATION
Title No.
CHARACTERISTICS
071010701281
Forward Current vs. Chromaticity Coordinate
Ta=25C 0.33 0.32 0.31 0.30 0.29
1mA 5mA
Spectrum
Relative Emission Intensity (a.u.)
0.34
1.2 1.0 0.8 0.6 0.4 0.2 0 350 450 550 650 Wavelength (nm) 750 Ta=25C IF=20mA
20mA 50mA 80mA
y
0.30
0.31
0.32
0.33
x Ambient Temperature vs. Chromaticity Coordinate
0.34
Relative Luminosity (a.u.)
Directivity
1.0 0 Ta=25C IFP=20mA X-X Y-Y 0.5 10 20 30 40 50
X
Y X Y
IFP=20mA 0.33
-30C
y
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0.32 0.31 0.30 0.29
0C 25C 50C 85C
60 70 80
0.30
0.31
0.32
0.33
0 90
x
60 30 Radiation Angle
0
0.5
90 1.0
Nichia STS-DA1-0013
Model
NESW020C
NICHIA CORPORATION
Title No.
CHARACTERISTICS
071010701291
3.4
0.73
1.2
K
A
Cathode mark C 0.12 3.8 (3.6) 2.3 (1.9)
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(0.45)
1.2 0.73 0.6 0.45
ITEM
0.68
MATERIALS Heat-Resistant Polymer Silicone Resin (with Diffused + Phosphor) Ag Plating Copper Alloy
PACKAGE ENCAPSULATING RESIN ELECTRODES
0.38
(0.05)
Nichia STS-DA1-0013
Cathode
0.3
Anode
Model
NxSW020C
Unit mm 15/1 Scale Allow 0.1
(NOTE) The LED may have flash/flange which exceeds the tolerance of this print.
NICHIA CORPORATION
Title No.
OUTLINE DIMENSIONS
060119649121
Taping part
1.5+0.1 -0 40.1 20.05 1.750.1 0.250.05
Reel part
180+0 -3
15.41 13+1 -0
Cathode mark 5.50.05 12+0.3 - 0.1
40.1
2 1 0.8
13
0.2
40.1
10.1 1.350.1
0.720.1 Label WHITE LED
TYPE NESW020CT LOT xxxxxxQTY pcs RoHS
Reel end of tape
No LEDs
LEDs mounting part
No LEDs
60+1 -0 Pull direction Top cover tape Embossed carrier tape
-13Reel Lead Min.160mm (No LEDs) Reel Lead Min.100mm (No LEDs) Reel Lead Min.400mm
5,000pcs/Reel
Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes.
Model
NESW020CT
Unit mm Scale Allow
Nichia STS-DA1-0013
NICHIA CORPORATION
Title No.
TAPING DIMENSIONS
071010701311
Nichia STS-DA1-0013
The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed. Reel Label Seal
NICHIA
WHITE LED
TYPE LOT QTY NxSW020xT xxxxxxPCS RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Moisture absorbent material
Moisture proof foil bag
The box is partitioned with the cardboard. Label
NICHIA
Nichia
LED
WHITE LED
TYPE RANK QTY NxSW020xT PCS RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
Packing unit
Moisture proof foil bag Cardboard box Cardboard box S Cardboard box M Cardboard box L Reel/bag 1reel Quantity/bag (pcs) 5,000 MAX. Reel/box 5reel MAX. 10reel MAX. 20reel MAX. Quantity/box (pcs) 25,000 MAX. 50,000 MAX. 100,000 MAX.
Dimensions (mm) 291 237 120 8t 259 247 243 5t 444 262 259 8t
Model
NxSW020xT
NICHIA CORPORATION
Title No.
PACKING
070510541732
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